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Plasma etching processes for CMOS device realization / edited by Nicolas Posseme.

Contributor(s): Posseme, Nicolas [editor.]Material type: TextTextPublisher: London, UK : Kidlington, Oxford, UK : ISTE Press ; Elsevier, 2017Description: 1 online resource (x, 121 pages) : illustrationsContent type: text Media type: computer Carrier type: online resourceISBN: 9780081011966; 0081011962Subject(s): Plasma etching | Metal oxide semiconductors, Complementary | TECHNOLOGY & ENGINEERING -- Electronics -- Semiconductors | Metal oxide semiconductors, Complementary | Plasma etchingGenre/Form: Electronic books.Additional physical formats: Print version:: Plasma etching for CMOS devices realization.DDC classification: 621.3815/2 LOC classification: TA2020Online resources: ScienceDirect
Contents:
Front Cover; Plasma Etching Processes for CMOS Device Realization; Copyright; Contents; Preface; 1 CMOS Devices Through the Years; 1.1. Scaling law by Dennard; 1.2. CMOS device improvement through the years; 1.3. Summary; 1.4. What is coming next?; 1.5. Bibliography; 2 Plasma Etching in Microelectronics; 2.1. Overview of plasmas and plasma etch tools; 2.2. Plasma surface interactions during plasma etching; 2.3. Patterns transfer by plasma etching; 2.4. Conclusion; 2.5. Bibliography; 3 Patterning Challenges in Microelectronics; 3.1. Optical immersion lithography.
3.2. Next-generation lithography3.3. Coclusion; 3.4. Bibliography; 4 Plasma Etch Challenges for Gate Patterning; 4.1. pSi gate etching; 4.2. Metal gate etching; 4.3. Stopping on the gate oxide; 4.4. High-k dielectric etching; 4.5. Line width roughness transfer during gate patterning; 4.6. Chamber wall consideration after gate patterning; 4.7. Summary; 4.8. Bibliography; List of Acronyms; List of Authors; Index; Back Cover.
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Item type Current library Call number Status Date due Barcode
Ebooks Ebooks Mysore University Main Library
Not for loan EBKELV721

Includes bibliographical references and index.

Online resource; title from PDF title page (ScienceDirect, viewed February 8, 2017).

Front Cover; Plasma Etching Processes for CMOS Device Realization; Copyright; Contents; Preface; 1 CMOS Devices Through the Years; 1.1. Scaling law by Dennard; 1.2. CMOS device improvement through the years; 1.3. Summary; 1.4. What is coming next?; 1.5. Bibliography; 2 Plasma Etching in Microelectronics; 2.1. Overview of plasmas and plasma etch tools; 2.2. Plasma surface interactions during plasma etching; 2.3. Patterns transfer by plasma etching; 2.4. Conclusion; 2.5. Bibliography; 3 Patterning Challenges in Microelectronics; 3.1. Optical immersion lithography.

3.2. Next-generation lithography3.3. Coclusion; 3.4. Bibliography; 4 Plasma Etch Challenges for Gate Patterning; 4.1. pSi gate etching; 4.2. Metal gate etching; 4.3. Stopping on the gate oxide; 4.4. High-k dielectric etching; 4.5. Line width roughness transfer during gate patterning; 4.6. Chamber wall consideration after gate patterning; 4.7. Summary; 4.8. Bibliography; List of Acronyms; List of Authors; Index; Back Cover.

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