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Nucleation and growth of metals : from thin films to nanoparticles / Paul-Henri Haumesser.

By: Haumesser, Paul-HenriMaterial type: TextTextSeries: RSC nanoscience & nanotechnologyPublication details: London, UK : Kidlington, Oxford : ISTE Press, Ltd. ; Elsevier, �2016Description: 1 online resourceContent type: text Media type: computer Carrier type: online resourceISBN: 0081012039; 9780081012031Subject(s): Metallic films | Nanostructured materials | TECHNOLOGY & ENGINEERING -- Metallurgy | Metallic films | Nanostructured materialsGenre/Form: Electronic books.Additional physical formats: Print version:: Nucleation and growth of metals.DDC classification: 669 LOC classification: TN673Online resources: ScienceDirect Summary: Nucleation and Growth of Metals: From Thin Films to Nanoparticles explores how nucleation and growth phenomena condition the morphology and related characteristics of metallic thin films and nanoparticles to help control the functional properties of these objects. The book brings a rigorous theoretical approach to nucleation and growth phenomena, with a particular focus on the essential aspects and outcomes of this theory. The author explores a general framework for the nucleation and growth of condensed phases from liquid solutions. Practical situations are extensively described, providing state-of-the art information on Cu electroplating and related processes for the fabrication of advanced interconnects and elaboration of metallic nanoparticles.
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Nucleation and Growth of Metals: From Thin Films to Nanoparticles explores how nucleation and growth phenomena condition the morphology and related characteristics of metallic thin films and nanoparticles to help control the functional properties of these objects. The book brings a rigorous theoretical approach to nucleation and growth phenomena, with a particular focus on the essential aspects and outcomes of this theory. The author explores a general framework for the nucleation and growth of condensed phases from liquid solutions. Practical situations are extensively described, providing state-of-the art information on Cu electroplating and related processes for the fabrication of advanced interconnects and elaboration of metallic nanoparticles.

Includes bibliographical references and index.

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